PCB factory Capabilities from Semshine PCB Manufacturer in China

Category	Description	Capability
File Formats	Gerber files- preferred	Gerber file 274-X or ODB++
	Drill file	3.3  leading  mm
Size	Max. finished PCB dimensions	400mm x 1200mm – Single/ Double-sided
		600mm x 700mm – Multilayer
Board Thickness	Standard	1.6mm ±10%
	Min.	0.6mm ±10%
	Max.	3.2mm ±10%
	Bow and twist	0.50%
Copper Thickness	Outer Cu weight	0.5oz-12oz
	Inner Cu weight	0.5oz-12oz
Laminate Materials	FR4(KB, ILM, Shengyi, Huazheng new material ) ,    High TG, Aluminum plate( Taiwan)
Board Cutting	Max. number of layers	20
	Min. thickness for inner layers (Cu thickness are    excluded)	0.05mm
Drilling	Min. size	0.20mm
	Max. size	6.00mm
	Drill Deviation	±0.075mm
	NPTH hole tolerance	±0.05mm
	Angle of Countersink	45°
PTH	Min. hole size	0.20mm
	Aspect ratio	8:1
Etching	Trace width tolerance	±20%
	Min. trace width / space (1oz finished Cu weight starting from 1/3oz)	75um/75um  (3mil/3mil)
	Min. trace width / space  (1oz finished Cu weight starting from 1/2oz)	89um/89um  (3.5mil/3.5mmil)
	Min. trace width / space (2oz finished Cu weight)	150um/150um  (6mil/6mil)
Solder Mask	Color	Green,White,Black,Red,Blue,Etc.
	Min. solder mask clearance	3mil
	Thickness	Line angle:8um(min),Linear plane:10um(min),    base material:20-50um
Silkscreen	Color	White,Black,Etc.
	Min. trace width	100um 4mil
	Min. size	0.7mm 28mil
Test	AOI	100%
	Flying Probe Tester	Sample 100%
	E-test	Mass order 100%
Controlled Impedance	Tolerance	+/-10%
	Impedance tester	Test impedance module
Profile	Tolerance	±0.10mm
	V—CUT Depth	±0.10mm
	V—CUT angle deviation	30°
	Semi-hole	Minimum half hole:0.40mm
Surface Finish	HASL,Immersion gold(ENIG),OSP

PCBA Capability

ISO 9001:2015 certification.
Ability to handle small quantities and provide quick turnaround.
Installation and rework of BGA and Micro-BGA components with 100% X-Ray Inspection and Automated Optical Inspection.
RoHS and Lead-Free assembly compliance.
Expertise in single or double-sided mixed technology PCB assembly.
Capability to work with both consigned components and provide turnkey solutions.
Proficiency in handling a wide range of devices, including various types of BGAs, CGAs, QFNs, DFNs, CSPs, and SONs.
Adherence to strict process requirements to ensure product quality and reliability.
With UL, CE, FCC, and Rohs Approval
Professional Surface-mounting and Through-hole soldering Technology.
SMT nitrogen reflow technology and DIP wave soldering technology.
Various packages like 1206,0805,0603 BGA components SMT technology.
ICT (In Circuit Test), FCT (Functional Circuit Test) Technology.
HDI board placement technology capacity.