Our custom laser‑cut SMT solder paste stencils are manufactured from high‑quality stainless steel foil according to customer Gerber files. Laser cutting ensures clean and smooth aperture walls for stable solder paste release during SMT printing. Optional electropolishing and nano‑coating treatments are available for fine‑pitch components such as 01005, 0201, QFP and BGA. Both framed and frameless formats are offered with multiple foil thickness options to match different PCB pad designs. Widely used for prototype and mass‑production PCBA assembly, improving printing consistency and reducing solder‑bridge defects.
| Product Parameters | |
|---|---|
| Service & Technical Parameters | 1. Manufacturing Technology: Laser cutting |
| 2. Raw Material | Stainless steel foil |
| 3. Standard Thickness | 0.08 mm, 0.10 mm, 0.12 mm, 0.13 mm, 0.15 mm, 0.20 mm |
| 4. Frame Option | Framed stencil / Frameless stencil |
| 5. Input File | Gerber files for stencil layer 6. Optional Process: Electropolishing, nano‑coating for fine‑pitch components |
| 7. Application | SMT solder paste printing for PCB & PCBA assembly |
| 8. Feature | Fine pitch opening for 0201, 01005, QFP, BGA components |
| 9. Lead Time | Fast prototype stencil service available |



